Thermal analysis of IC components undergoing solder reflow /
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
1996.
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Physical Description: | xiii 145 leaves : ill. (some col.) ; 30 cm. |
|---|---|
| Bibliography: | Bibliography: leaves 140-145. |