APA引文

Tan, S. W. (1997). Development of non-post mold cure alternative for semiconductor packaging.

Chicago Style (17th ed.) Citation

Tan, Sook Wai. Development of Non-post Mold Cure Alternative for Semiconductor Packaging. 1997.

MLA引文

Tan, Sook Wai. Development of Non-post Mold Cure Alternative for Semiconductor Packaging. 1997.

警告：這些引文格式不一定是100％准確.