Development of non-post mold cure alternative for semiconductor packaging /

相似書籍

• Study of alternative packaging materials for semiconductor devices /
  由: Suprammaniam, Sugumar
  出版: (1997)
• The effect of silica on the cure kinetics of epoxy resin with aromatic diamines /
  由: Wong, Juliana K.C
  出版: (1997)
• Package cracking mechanism in plastic encapsulated integrated circuit devices /
  由: Tan, Geok Leong
  出版: (1993)
• Microwave radiation curing of epoxy/diamine systems /
  由: Yap, Boon Huey
  出版: (1997)
• Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
  由: Low, Pui Leng
  出版: (2020)