مواد مشابهة
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Reliability of wire bonding in micro electronic packaging /
بواسطة: Ghazali Omar
منشور في: (1996) -
3D visual inspection of IC bonding wires /
بواسطة: Han, Xiao
منشور في: (1997) -
A study of the Au-Al wire bonding image using mixture distribution /
بواسطة: Liew, Kian Wah
منشور في: (2004) -
The effect of eugenol containing temporary cement on the bond strength of commonly used bonding systems /
بواسطة: Ithnaniah Abdul Wahab
منشور في: (2005) -
Wearout reliability studies of bonding wires used in nano electronic device packaging
بواسطة: Gan, Chong Leong