3D visual inspection of IC bonding wires /

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Bibliographic Details
Main Author: Han, Xiao
Format: Thesis Book
Language:English
Published: 1997.
Subjects:
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008 980616s1997 si v 00 1 eng m
035 |a ACF-2704 
040 |a UMM 
090 |a TA1637  |b Han 
100 1 0 |a Han, Xiao 
245 1 0 |a 3D visual inspection of IC bonding wires /  |c by Han Xiao. 
260 |c 1997. 
300 |a vii, 103 leaves :  |b ill. ;  |c 30 cm. 
502 |a Dissertation (M.Eng.) -- National University of Singapore, 1997. 
504 |a Bibliography: leaves 98-103. 
650 0 |a Image processing. 
650 0 |a Integrated circuits  |x Testing. 
650 0 |a Metal bonding  |x Testing 
948 |a 16/06/1998  |b 25/11/2000 
596 |a 1 
999 |a TA1637 HAN  |w LC  |c 1  |i A507918801  |l STACKS  |m P01UTAMA  |r Y  |s Y  |t TESIS  |u 23/7/1998