APA (7th ed.) Citation

Lin, T. (1999). Hygrothermally-induced delamination and cracking in plastic IC packages.

Chicago Style (17th ed.) Citation

Lin, Tingyu. Hygrothermally-induced Delamination and Cracking in Plastic IC Packages. 1999.

MLA (8th ed.) Citation

Lin, Tingyu. Hygrothermally-induced Delamination and Cracking in Plastic IC Packages. 1999.

Warning: These citations may not always be 100% accurate.