Delamination propagation in plastic IC packages during solder reflow /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1999.
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| Subjects: | |
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| Item Description: | Spine title: Delam. prop. in plastic IC packages during solder reflow. |
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| Physical Description: | xi, 130 leaves : ill. ; 30 cm. |
| Bibliography: | Bibliography: leaves 123-130. |