Delamination propagation in plastic IC packages during solder reflow /

Delamination propagation in plastic IC packages during solder reflow /

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书目详细资料
主要作者:	Ma, Yiyi
格式:	Thesis 图书
语言:	English
出版:	1999.
主题:	Plastics in packaging > Fracture Electronic packaging.
标签:	添加标签没有标签, 成为第一个标记此记录!

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