APA引文

Liu, L. (1999). Thermal behavior of tantalum-based diffusion barriers in Cu/Si metallization.

Chicago Style (17th ed.) Citation

Liu, Ling. Thermal Behavior of Tantalum-based Diffusion Barriers in Cu/Si Metallization. 1999.

MLA引文

Liu, Ling. Thermal Behavior of Tantalum-based Diffusion Barriers in Cu/Si Metallization. 1999.

警告：这些引文格式不一定是100％准确.