Thermal behavior of tantalum-based diffusion barriers in Cu/Si metallization /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1999.
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| LEADER | 00714cam a2200205 a 4500 | ||
|---|---|---|---|
| 001 | u476893 | ||
| 003 | SIRSI | ||
| 008 | 010220s1999 si a v 00 10 eng m | ||
| 035 | |a ACO-1458 | ||
| 040 | |a UMM | ||
| 090 | |a TA403 |b NUS 1999 Liu | ||
| 100 | 1 | 0 | |a Liu, Ling. |
| 245 | 1 | 0 | |a Thermal behavior of tantalum-based diffusion barriers in Cu/Si metallization / |c Liu Ling. |
| 260 | |c 1999. | ||
| 300 | |a xi, 132 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Sc.) -- National University of Singapore, 1999. | ||
| 504 | |a Includes bibliographical references. | ||
| 948 | |a 22/02/2001 |b 29/10/2002 | ||
| 596 | |a 1 | ||
| 999 | |a TA403 NUS 1999 LIU |w LC |c 1 |i A510139067 |l B_KOM4 |m P01UTAMA |r Y |s Y |t TESIS |u 12/11/2002 |o .PUBLIC. BKOM 4 : 45161 | ||