Analysis of foreign matter materials related to the die attach process of semiconductor device packaging /

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Bibliographic Details
Main Author: Tengku Elisa Bustaman
Format: Thesis Book
Language:English
Published: 1999.
Subjects:
Online Access:http://studentsrepo.um.edu.my/id/eprint/2859
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Description
Physical Description:iv, 134 leaves : ill., (some col.) ; 30 cm.
Bibliography:Bibliography : leaves 85-86