Analysis of foreign matter materials related to the die attach process of semiconductor device packaging /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1999.
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/id/eprint/2859 |
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| Physical Description: | iv, 134 leaves : ill., (some col.) ; 30 cm. |
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| Bibliography: | Bibliography : leaves 85-86 |