Ling, J. T. (2000). Electrodeposition of copper on polished copper electrode.
Chicago Style (17th ed.) CitationLing, Jia Tsung. Electrodeposition of Copper on Polished Copper Electrode. 2000.
MLA (8th ed.) CitationLing, Jia Tsung. Electrodeposition of Copper on Polished Copper Electrode. 2000.
Warning: These citations may not always be 100% accurate.