Xiong, Z. (2000). A numerical study of fracture in plastic IC packages.
Chicago Style (17th ed.) CitationXiong, Zhengpeng. A Numerical Study of Fracture in Plastic IC Packages. 2000.
MLA (8th ed.) CitationXiong, Zhengpeng. A Numerical Study of Fracture in Plastic IC Packages. 2000.
Warning: These citations may not always be 100% accurate.