APA引文

Xiong, Z. (2000). A numerical study of fracture in plastic IC packages.

Chicago Style (17th ed.) Citation

Xiong, Zhengpeng. A Numerical Study of Fracture in Plastic IC Packages. 2000.

MLA引文

Xiong, Zhengpeng. A Numerical Study of Fracture in Plastic IC Packages. 2000.

警告：这些引文格式不一定是100％准确.