Yu, W. (2001). Surface modification and metallization of a polyimide for microelectronic package.
Chicago Style (17th ed.) CitationYu, Weixing. Surface Modification and Metallization of a Polyimide for Microelectronic Package. 2001.
MLA (8th ed.) CitationYu, Weixing. Surface Modification and Metallization of a Polyimide for Microelectronic Package. 2001.
Warning: These citations may not always be 100% accurate.