Yu, W. (2001). Surface modification and metallization of a polyimide for microelectronic package.
Chicago Style (17th ed.) CitationYu, Weixing. Surface Modification and Metallization of a Polyimide for Microelectronic Package. 2001.
MLA引文Yu, Weixing. Surface Modification and Metallization of a Polyimide for Microelectronic Package. 2001.
警告：這些引文格式不一定是100％准確.