Surface modification and metallization of a polyimide for microelectronic package /

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Bibliographic Details
Main Author: Yu, Weixing
Format: Thesis Book
Language:English
Published: 2001.
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035 |a ACW-4885 
040 |a UMM 
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100 1 0 |a Yu, Weixing. 
245 1 0 |a Surface modification and metallization of a polyimide for microelectronic package /  |c Yu Weixing. 
260 |c 2001. 
300 |a xiii, 127 leaves :  |b ill. ;  |c 30 cm. 
502 |a Dissertation (M.Eng.) -- National University of Singapore, 2001. 
504 |a Bibliography: leaves 122-127. 
948 |a 26/11/2002  |b 26/11/2002 
596 |a 1 
999 |a TP7 NUS 2001 YU  |w LC  |c 1  |i A510669879  |l B_KOM4  |m P01UTAMA  |r Y  |s Y  |t TESIS  |u 24/12/2002  |o .PUBLIC. bkom 4 : 43321