Surface modification and metallization of a polyimide for microelectronic package /

Surface modification and metallization of a polyimide for microelectronic package /

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書目詳細資料
主要作者:	Yu, Weixing
格式:	Thesis 圖書
語言:	English
出版:	2001.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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