Surface modification and metallization of a polyimide for microelectronic package /

Surface modification and metallization of a polyimide for microelectronic package /

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书目详细资料
主要作者:	Yu, Weixing
格式:	Thesis 图书
语言:	English
出版:	2001.
标签:	添加标签没有标签, 成为第一个标记此记录!

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