Seah, S. K. W. (2002). Study of interconnect reliability in BGA packging.
Chicago Style (17th ed.) CitationSeah, Simon Kah Woon. Study of Interconnect Reliability in BGA Packging. 2002.
MLA (8th ed.) CitationSeah, Simon Kah Woon. Study of Interconnect Reliability in BGA Packging. 2002.
Warning: These citations may not always be 100% accurate.