APA引文

Seah, S. K. W. (2002). Study of interconnect reliability in BGA packging.

Chicago Style (17th ed.) Citation

Seah, Simon Kah Woon. Study of Interconnect Reliability in BGA Packging. 2002.

MLA引文

Seah, Simon Kah Woon. Study of Interconnect Reliability in BGA Packging. 2002.

警告：这些引文格式不一定是100％准确.