Study of interconnect reliability in BGA packging /
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
2002.
|
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 00700nam a2200205 a 4500 | ||
|---|---|---|---|
| 001 | u520496 | ||
| 003 | SIRSI | ||
| 008 | 040219s2002 si v 00 1 eng m | ||
| 035 | |a ADA-4358 | ||
| 040 | |a UMM | ||
| 090 | |a TJ7 |b NUS 2002 Sea | ||
| 100 | 1 | 0 | |a Seah, Simon Kah Woon |
| 245 | 1 | 0 | |a Study of interconnect reliability in BGA packging / |c Seah Kah Woon Simon. |
| 260 | |c 2002. | ||
| 300 | |a ix, 92, A-21 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng.) -- National University of Singapore, 2002. | ||
| 504 | |a Bibliography: leaves 90-92. | ||
| 948 | |a 01/03/2004 |b 01/03/2004 | ||
| 596 | |a 1 | ||
| 999 | |a TJ7 NUS 2002 SEA |w LC |c 1 |i A511201273 |l B_KOM4 |m P01UTAMA |r Y |s Y |t TESIS |u 12/3/2004 |o .PUBLIC. BKOM 4 : 45853 | ||