APA (7th ed.) Citation

Ng, C. C. (2005). Warpage and stress analysis of molded strip and stacked die quad flat no-lead package.

Chicago Style (17th ed.) Citation

Ng, Cheong Chiang. Warpage and Stress Analysis of Molded Strip and Stacked Die Quad Flat No-lead Package. 2005.

MLA (8th ed.) Citation

Ng, Cheong Chiang. Warpage and Stress Analysis of Molded Strip and Stacked Die Quad Flat No-lead Package. 2005.

Warning: These citations may not always be 100% accurate.