APA引文

Ng, C. C. (2005). Warpage and stress analysis of molded strip and stacked die quad flat no-lead package.

Chicago Style (17th ed.) Citation

Ng, Cheong Chiang. Warpage and Stress Analysis of Molded Strip and Stacked Die Quad Flat No-lead Package. 2005.

MLA引文

Ng, Cheong Chiang. Warpage and Stress Analysis of Molded Strip and Stacked Die Quad Flat No-lead Package. 2005.

警告：這些引文格式不一定是100％准確.