A study of stress in backend metallization in ULSI devices /

A study of stress in backend metallization in ULSI devices /

محفوظ في:

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Goh, Chia Lan
التنسيق:	أطروحة كتاب
اللغة:	English
منشور في:	2006.
الموضوعات:	Integrated circuits > Ultra large scale integration. Strains and stresses.
الوسوم:	إضافة وسم لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!

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