Shutesh Krishnan. (2007). Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages.
Chicago Style (17th ed.) CitationShutesh Krishnan. Design and Materials for Microelectronic Package-improvement of Interfacial Adhesion in Plastic Packages. 2007.
MLA (8th ed.) CitationShutesh Krishnan. Design and Materials for Microelectronic Package-improvement of Interfacial Adhesion in Plastic Packages. 2007.
Warning: These citations may not always be 100% accurate.