APA (7th ed.) Citation

Shutesh Krishnan. (2007). Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages.

Chicago Style (17th ed.) Citation

Shutesh Krishnan. Design and Materials for Microelectronic Package-improvement of Interfacial Adhesion in Plastic Packages. 2007.

MLA (8th ed.) Citation

Shutesh Krishnan. Design and Materials for Microelectronic Package-improvement of Interfacial Adhesion in Plastic Packages. 2007.

Warning: These citations may not always be 100% accurate.