APA引文

Shutesh Krishnan. (2007). Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages.

Chicago Style (17th ed.) Citation

Shutesh Krishnan. Design and Materials for Microelectronic Package-improvement of Interfacial Adhesion in Plastic Packages. 2007.

MLA引文

Shutesh Krishnan. Design and Materials for Microelectronic Package-improvement of Interfacial Adhesion in Plastic Packages. 2007.

警告：这些引文格式不一定是100％准确.