Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /

Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /

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书目详细资料
主要作者:	Shutesh Krishnan
格式:	Thesis 图书
语言:	English
出版:	2007.
主题:	Microelectronic packaging. Packaging.
标签:	添加标签没有标签, 成为第一个标记此记录!

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