The effects of annealing, temperature and humidity on tin whiskers formation /
Saved in:
主要作者: | Lee, Hua Xing |
---|---|
格式: | Thesis 圖書 |
語言: | English |
出版: |
2009.
|
主題: | |
標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
相似書籍
-
Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
由: Prakash Babu Balakrishnan
出版: (2012) -
Investigation of mechanical properties of paper-based packaging materials /
由: Masni-Azian Akiah
出版: (2011) -
Thermoelectric properties of novel microstructurally modified CoSb3 skutterudite materials by minor dopants of Mn, Hf, AI, Bi and Yb /
由: Yousef, Mohamed Hamid Elsheikh
出版: (2016) -
Time & temperature optimization for iron-boron pair (Fe-B) dissociation in silicon wafers by surface photovoltage (SPV) method /
由: Phang, Siew Wei
出版: (2006) -
Estimation of TE power generations from thermal oil heater and te material synthesis /
由: Barma, Milan Chandra
出版: (2016)