Tay, S. L. (2011). Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder.
Chicago Style (17th ed.) CitationTay, See Leng. Effects of Nickel and Cobalt Nanoparticle Additions to Sn-Ag-Cu Solder. 2011.
MLA引文Tay, See Leng. Effects of Nickel and Cobalt Nanoparticle Additions to Sn-Ag-Cu Solder. 2011.
警告:这些引文格式不一定是100%准确.