Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /

Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /

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書目詳細資料
主要作者:	Tay, See Leng
格式:	Thesis 圖書
語言:	English
出版:	2011.
主題:	Electronic packaging > Materials. Solder and soldering > Materials. Nanocomposites (Materials). Cobalt. Nickel.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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