The effect of copper particle addition into Sn-3.5Ag solder /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2011.
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| Subjects: | |
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| Physical Description: | xvii, 100 leaves : ill. ; 30 cm. |
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| Bibliography: | Bibliography: leaves 92-99. |