The effect of copper particle addition into Sn-3.5Ag solder /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2011.
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| LEADER | 01161cam a2200289 a 4500 | ||
|---|---|---|---|
| 001 | u840995 | ||
| 003 | SIRSI | ||
| 005 | 201110171159 | ||
| 008 | 111017s2011 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ | ||
| 090 | |a TA7 |b UM 2011 Aemnas | ||
| 097 | |a TA7 |b UM 2011 Aemnas | ||
| 100 | 0 | |a Aemi Nadia Ahmad Sauffi. | |
| 245 | 1 | 4 | |a The effect of copper particle addition into Sn-3.5Ag solder / |c Aemi Nadia binti Ahmad Sauffi. |
| 260 | |c 2011. | ||
| 300 | |a xvii, 100 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng.Sc.) -- Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya, 2011. | ||
| 504 | |a Bibliography: leaves 92-99. | ||
| 650 | 0 | |a Lead-free electronics manufacturing processes. | |
| 650 | 0 | |a Nanotechnology. | |
| 650 | 0 | |a Copper |x Metallurgy. | |
| 650 | 0 | |a Solder and soldering. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik. | |
| 900 | |a NHS | ||
| 596 | |a 1 7 | ||
| 999 | |a TA7 UM 2011 AEMNAS |w LC |c 1 |i A514831687 |d 1/10/2014 |e 1/10/2014 |f 1/6/2012 |g 1 |l STACKS |m P01UTAMA |n 3 |r Y |s Y |t TESIS |u 31/5/2012 | ||
| 999 | |a TA7 UM 2011 AEMNAS |w LC |c 1 |i A514909347 |d 8/4/2014 |f 8/4/2014 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 3/4/2014 | ||