APA引文

Ong, S. K. (2011). Study of improvement in wire bonding process through critical parameters analysis.

Chicago Style (17th ed.) Citation

Ong, Siew Kee. Study of Improvement in Wire Bonding Process Through Critical Parameters Analysis. 2011.

MLA引文

Ong, Siew Kee. Study of Improvement in Wire Bonding Process Through Critical Parameters Analysis. 2011.

警告：這些引文格式不一定是100％准確.