Study of improvement in wire bonding process through critical parameters analysis /

Study of improvement in wire bonding process through critical parameters analysis /

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Bibliographic Details
Main Author: Ong, Siew Kee
Format: Thesis Book
Language:English
Published: 2011.
Subjects:
Wire bonding (Electronic packaging).
Electric circuit analysis.
Electronic packaging > Reliability.
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Description
Physical Description:[1] x, 70 leaves : ill. ; 30 cm.
Bibliography:Bibliography: leaves 66-70.

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