Chew, C. S. (2011). Performance of Ni-W alloys as barrier film between lead free solder and copper substrate.
توثيق أسلوب شيكاغو (الطبعة السابعة عشر)Chew, Chee Sean. Performance of Ni-W Alloys as Barrier Film Between Lead Free Solder and Copper Substrate. 2011.
توثيق جمعية اللغة المعاصرة MLA (الطبعة الثامنة)Chew, Chee Sean. Performance of Ni-W Alloys as Barrier Film Between Lead Free Solder and Copper Substrate. 2011.
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