APA引文

Chew, C. S. (2011). Performance of Ni-W alloys as barrier film between lead free solder and copper substrate.

Chicago Style (17th ed.) Citation

Chew, Chee Sean. Performance of Ni-W Alloys as Barrier Film Between Lead Free Solder and Copper Substrate. 2011.

MLA引文

Chew, Chee Sean. Performance of Ni-W Alloys as Barrier Film Between Lead Free Solder and Copper Substrate. 2011.

警告：这些引文格式不一定是100％准确.