Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
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| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
2011.
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/id/eprint/8014 |
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| 001 | u853973 | ||
| 003 | SIRSI | ||
| 005 | 201203301759 | ||
| 008 | 120330s2011 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ |d AUM |e rda | ||
| 090 | |a TJ7 |b UM 2011 Che | ||
| 097 | |a TJ7 |b UM 2011 Che | ||
| 100 | 1 | |a Chew, Chee Sean. | |
| 245 | 1 | 0 | |a Performance of Ni-W alloys as barrier film between lead free solder and copper substrate / |c Chew Chee Sean. |
| 264 | 1 | |c 2011. | |
| 264 | 4 | |c 2011. | |
| 300 | |a xv, 91 [2] leaves : |b ill. ; |c 30 cm. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |a Dissertation (M.Eng.Sc.) -- Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya, 2011. | ||
| 504 | |a Bibliography: leaves 77-84. | ||
| 650 | 0 | |a Solder and soldering. | |
| 650 | 0 | |a Lead-free electronics manufacturing processes. | |
| 650 | 0 | |a Microscopy. | |
| 650 | 0 | |a Copper. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik. | |
| 856 | 4 | 1 | |u http://studentsrepo.um.edu.my/id/eprint/8014 |
| 900 | |a NHS | ||
| 596 | |a 1 7 25 | ||
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