Study of the effect of process variation on wire bond process of IC assembly /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2012.
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| LEADER | 01299cam a2200301 a 4500 | ||
|---|---|---|---|
| 001 | u864702 | ||
| 003 | SIRSI | ||
| 005 | 201209191040 | ||
| 008 | 120919s2012 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ | ||
| 090 | |a TK7 |b UM 2012 Intms | ||
| 097 | |a TK7 |b UM 2012 Intms | ||
| 100 | 0 | |a Intan Mastura Saadon. | |
| 245 | 1 | 0 | |a Study of the effect of process variation on wire bond process of IC assembly / |c Intan Mastura binti Saadon. |
| 260 | |c 2012. | ||
| 300 | |a xiii, 68 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng.) -- Jabatan Kejuruteraan Elektrik, Fakulti Kejuruteraan, Universiti Malaya, 2012. | ||
| 504 | |a Bibliography: leaves 67-68. | ||
| 596 | |a 1 7 | ||
| 650 | 0 | |a Wire bonding (Electronic packaging). | |
| 650 | 0 | |a Electronic packaging |x Reliability. | |
| 650 | 0 | |a Electronic packaging |x Defects. | |
| 650 | 0 | |a Semiconductors |x Failures. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Elektrik. | |
| 900 | |a US-ZA | ||
| 999 | |a TK7 UM 2012 INTMS |w LC |c 1 |i A515288525 |d 27/2/2013 |f 27/2/2013 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 25/2/2013 | ||
| 999 | |a TK7 UM 2012 INTMS |w LC |c 1 |i A515834194 |d 2/6/2014 |f 2/6/2014 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 26/5/2014 | ||
| 999 | |a TK7 UM 2012 INTMS |w LC |c 2 |i A515836460 |d 2/6/2014 |f 2/6/2014 |g 1 |l COUNTER |m P07JURUTER |r N |s Y |t CD |u 29/5/2014 | ||