Study of the effect of process variation on wire bond process of IC assembly /

Study of the effect of process variation on wire bond process of IC assembly /

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書目詳細資料
主要作者:	Intan Mastura Saadon
格式:	Thesis 圖書
語言:	English
出版:	2012.
主題:	Wire bonding (Electronic packaging). Electronic packaging > Reliability. Electronic packaging > Defects. Semiconductors > Failures.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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