Ronald Reegan Raipen. (2012). Study on the conversion of wire material from gold to copper in semiconductor ball grid packaging.
Chicago Style (17th ed.) CitationRonald Reegan Raipen. Study on the Conversion of Wire Material from Gold to Copper in Semiconductor Ball Grid Packaging. 2012.
MLA (8th ed.) CitationRonald Reegan Raipen. Study on the Conversion of Wire Material from Gold to Copper in Semiconductor Ball Grid Packaging. 2012.
Warning: These citations may not always be 100% accurate.