APA引文

Ronald Reegan Raipen. (2012). Study on the conversion of wire material from gold to copper in semiconductor ball grid packaging.

Chicago Style (17th ed.) Citation

Ronald Reegan Raipen. Study on the Conversion of Wire Material from Gold to Copper in Semiconductor Ball Grid Packaging. 2012.

MLA引文

Ronald Reegan Raipen. Study on the Conversion of Wire Material from Gold to Copper in Semiconductor Ball Grid Packaging. 2012.

警告：這些引文格式不一定是100％准確.