Study on the conversion of wire material from gold to copper in semiconductor ball grid packaging /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2012.
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| LEADER | 01275cam a2200277 a 4500 | ||
|---|---|---|---|
| 001 | u870391 | ||
| 003 | SIRSI | ||
| 005 | 201212191535 | ||
| 008 | 121219s2012 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ |e rda | ||
| 090 | |a TS176 |b UM 2012 Ron | ||
| 097 | |a TS176 |b UM 2012 Ron | ||
| 100 | 1 | |a Ronald Reegan Raipen. | |
| 245 | 1 | 0 | |a Study on the conversion of wire material from gold to copper in semiconductor ball grid packaging / |c Ronald Reegan a/l Raipen. |
| 260 | |c 2012. | ||
| 300 | |a xiii, 120 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng. (Manuf.)) -- Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan, Universiti Malaya, 2012. | ||
| 504 | |a Bibliography: leaves 101-102. | ||
| 650 | 0 | |a Semiconductors |x Materials. | |
| 650 | 0 | |a Semiconductors |x Testing. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Rekabentuk dan Pembuatan. | |
| 900 | |a US-ZA | ||
| 596 | |a 1 7 | ||
| 999 | |a TS176 UM 2012 RON |w LC |c 1 |i A515295778 |d 28/9/2015 |e 28/9/2015 |f 26/9/2013 |g 1 |l STACKS |m P01UTAMA |n 1 |r Y |s Y |t TESIS |u 25/9/2013 | ||
| 999 | |a TS176 UM 2012 RON |w LC |c 1 |i A516085679 |d 12/1/2015 |f 12/1/2015 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 12/1/2015 | ||
| 999 | |a TS176 UM 2012 RON |w LC |c 2 |i A516150298 |d 12/1/2015 |f 12/1/2015 |g 1 |l COUNTER |m P07JURUTER |r N |s Y |t CD |u 12/1/2015 | ||