Study on the conversion of wire material from gold to copper in semiconductor ball grid packaging /

مواد مشابهة

• Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
  بواسطة: Prakash Babu Balakrishnan
  منشور في: (2012)
• Effect of lot size on cycle time for semiconductor back-end manufacturing : a simulation approach /
  بواسطة: Tong, Douglas Kum Tien
  منشور في: (2006)
• Analysis of foreign matter materials related to the die attach process of semiconductor device packaging /
  بواسطة: Tengku Elisa Bustaman
  منشور في: (1999)
• Kinetic growth of copper oxidation in semiconductor packaging /
  بواسطة: Siti Rahmah Esa
  منشور في: (2017)
• Reliability of wire bonding in micro electronic packaging /
  بواسطة: Ghazali Omar
  منشور في: (1996)