Study on the conversion of wire material from gold to copper in semiconductor ball grid packaging /

Study on the conversion of wire material from gold to copper in semiconductor ball grid packaging /

Saved in:

書目詳細資料
主要作者:	Ronald Reegan Raipen
格式:	Thesis 圖書
語言:	English
出版:	2012.
主題:	Semiconductors > Materials. Semiconductors > Testing.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

相似書籍

Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
由: Prakash Babu Balakrishnan
出版: (2012)

Effect of lot size on cycle time for semiconductor back-end manufacturing : a simulation approach /
由: Tong, Douglas Kum Tien
出版: (2006)

Analysis of foreign matter materials related to the die attach process of semiconductor device packaging /
由: Tengku Elisa Bustaman
出版: (1999)

Kinetic growth of copper oxidation in semiconductor packaging /
由: Siti Rahmah Esa
出版: (2017)

Reliability of wire bonding in micro electronic packaging /
由: Ghazali Omar
出版: (1996)

Semiconductor equipment jam rate improvement by using computational fluid dynamics /
由: Chee, Wai Koon
出版: (2010)

Copper-induced deep level defects in GaAs0.6P0.4 alloy semiconductor /
由: Hu, Peh Yin
出版: (1992)

Wire sweep characteristics of multi-tier palladium-copper wire bonding on low quad flat package with low alpha green mold compound /
由: Siti Sofiyah Skh Ali

Synthesis and conductivity of copper zinc tin selenide quaternary chalcogenide semiconductor
由: Leong, Yong Jian
出版: (2016)

Surface and localised states in semiconductor superlattices /
由: Chua, Thai Cheng
出版: (1995)

Statistical analysis of wire-bond pull strength and accelerated stress-testing study /
由: Liu, Hao
出版: (1997)

Organic and non-organic semiconductor materials for pulsed fiber laser generation in 1.55-micron region /
由: Farina Saffa Mohamad Samsamnun
出版: (2021)

Correlation of electronic and thermal properties of semiconductor devices /
由: Palaniappn Muthupalaniappan
出版: (1999)

Investigation of the effects of phonons on the characteristics of semiconductor quantum dot based structures /
由: Nahri, Davoud Ghodsi
出版: (2017)

Novel synthesis of Al2-xHfxO3 materials and the fabrication of gate dielectric thin films for metal oxide semiconductor applications / Annie Maria Mahat
由: Mahat, Annie Maria
出版: (2019)

The effects of annealing, temperature and humidity on tin whiskers formation /
由: Lee, Hua Xing
出版: (2009)

Electrochemical Deposition and Characterization of Copper Indium Disulfide Semiconductor Thin Films
由: Teo, Sook Liang
出版: (2011)

Developing incremental capacity during seasonal demand for technologies beyond 90 NM in semiconductor fabrication industry
由: Mohd Azizi, Chik

Fillet height failure on low K PBGA packages /
由: Vittal Raja Manikam
出版: (2008)

Modeling and theoretical studies of semiconductor laser guide /
由: Mohd Sharizal Alias
出版: (2005)

A study on the semiconductor industry of Singapore /
由: Chen, Jia
出版: (1996)

How can a startup fabless semiconductor company compete? /
由: Tay, Kah Choon
出版: (1996)

An investigation into the electron beam induced current effects on semiconductor materials and devices /
由: Ong, Vincent Keng Sian
出版: (1995)

Theoretical calculations of defect processes on the surface and bulk of semiconductors /
由: Khoo, Guan Seng
出版: (1992)

Optical feedback effects in external cavity semiconductor lasers /
由: Chan, Kam Yee
出版: (1993)

The importance of minority carrier lifetime in silicon semiconductor devices /
由: Shamsul Zawal
出版: (1997)

Modelling of anomalous charge carriers transport in disordered organic semiconductors /
由: Choo, Kan Yeep
出版: (2017)

Coherence and frequency stability of semiconductor lasers under cooperation and modulation /
由: Loh, Wei Hung
出版: (2002)

Improved define-measure-analyze-improve-control methodology for process improvement in semiconductor industry
由: Ong, Siew Ying
出版: (2014)

The semiconductor assembly equipment industry of Singapore /
由: Lee, Wai Kwong
出版: (1996)

Dynamical behaviours of semiconductor lasers in relation to picosecond optical pulse generation by gain switching /
由: Chong, Tow Chong
出版: (1983)

A study of the semiconductor industry in Singapore /
由: Thong, Pao-Yi
出版: (1991)

A spectroscopic photoemission microscopy system for semiconductor device analysis /
由: Koh, Lian-Ser
出版: (1994)

Ultra shallow secondary ion mass spectrometric studies on semiconductors /
由: Ng, Chee Mang
出版: (2001)

Optical absorption studies of heavily doped silicon /
由: Aw, Siew Eng
出版: (1986)

Methodology of solder paste selection in semiconductor industry /
由: Govindasamy, Subramaniam D.
出版: (1996)

A survey on semiconductor water fabrication in Malaysia /
由: Lai, Kian Kee
出版: (2000)

Nuclear microscopy of wide band gap semiconductors /
由: Teo, Ee Jin
出版: (2002)

Human resource implications of strategic changes affecting the semiconductor industry in Singapore /
由: Tan, Pheng Huat
出版: (1991)

Warpage and stress analysis of molded strip and stacked die quad flat no-lead package /
由: Ng, Cheong Chiang
出版: (2005)

Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group