Integrated circuit package chipping methodology improvement by using DMAIC /

Integrated circuit package chipping methodology improvement by using DMAIC /

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Bibliographic Details
Main Author: Kam, Crispian Weng Kit
Format: Thesis Book
Language:English
Published: 2013
Subjects:
Integrated circuits > Management.
Reengineering (Management)
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Description
Physical Description:xiii, 71 leaves : ill. ; 30 cm.
Bibliography:Bibliography: leaves 62-67

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