Integrated circuit package chipping methodology improvement by using DMAIC /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2013
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| LEADER | 01185cam a2200277 a 4500 | ||
|---|---|---|---|
| 001 | u888016 | ||
| 003 | SIRSI | ||
| 005 | 201309111351 | ||
| 008 | 130911s2013 my t 000 0 eng m | ||
| 040 | |a UMM |d UMJ |e rda | ||
| 090 | |a TK7 |b UM 2013 Kam | ||
| 097 | |a TK7 |b UM 2013 Kam | ||
| 100 | 1 | |a Kam, Crispian Weng Kit. | |
| 245 | 1 | 0 | |a Integrated circuit package chipping methodology improvement by using DMAIC / |c Crispian Kam Weng Kit. |
| 260 | |c 2013 | ||
| 300 | |a xiii, 71 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng) -- Jabatan Kejuruteraan Elektrik, Fakulti Kejuruteraan, Universiti Malaya, 2013. | ||
| 504 | |a Bibliography: leaves 62-67 | ||
| 650 | 0 | |a Integrated circuits |x Management. | |
| 650 | 0 | |a Reengineering (Management) | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Elektrik. | |
| 900 | |a HA-ZA | ||
| 596 | |a 1 7 | ||
| 999 | |a TK7 UM 2013 KAM |w LC |c 1 |i A515671451 |d 9/7/2014 |f 9/7/2014 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 7/7/2014 | ||
| 999 | |a TK7 UM 2013 KAM |w LC |c 1 |i A516084523 |d 13/1/2015 |f 13/1/2015 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 12/1/2015 | ||
| 999 | |a TK7 UM 2013 KAM |w LC |c 2 |i A516150134 |d 13/1/2015 |f 13/1/2015 |g 1 |l COUNTER |m P07JURUTER |r N |s Y |t CD |u 12/1/2015 | ||