Modelling the stresses in VLSI plastic packages /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1989.
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| Subjects: | |
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| LEADER | 00738cam a2200229 a 4500 | ||
|---|---|---|---|
| 001 | u95749 | ||
| 003 | SIRSI | ||
| 008 | 910521s1989 si v 00 1 eng m | ||
| 035 | |a AAK-4617 | ||
| 040 | |a UMM | ||
| 090 | |a TK7874 |b Ng | ||
| 100 | 1 | 0 | |a Ng, Kiang Chong. |
| 245 | 1 | 0 | |a Modelling the stresses in VLSI plastic packages / |c by Ng Kiang Chong. |
| 260 | 1 | |c 1989. | |
| 300 | |a 1 v. : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Sc.) -- National University of Singapore, 1989. | ||
| 504 | |a Bibliography: p. 41-42. | ||
| 650 | 0 | |a Integrated circuits |x Very large scale integration. | |
| 650 | 0 | |a Finite element method. | |
| 948 | |a 14/08/1991 |b 03/09/2002 | ||
| 596 | |a 1 | ||
| 999 | |a TK7874 NG |w LC |c 1 |i A010868396 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 17/3/1992 | ||