Shnawah, D. A. (2013). Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications.
Chicago Style (17th ed.) CitationShnawah, Dhafer Abdul-Ameer. Mechanical, Thermal and Microstructural Properties of the Low-Ag-content Sn-1Ag-0.5Cu Solder Alloy Bearing Fe or A1 for Electronics Applications. 2013.
MLA引文Shnawah, Dhafer Abdul-Ameer. Mechanical, Thermal and Microstructural Properties of the Low-Ag-content Sn-1Ag-0.5Cu Solder Alloy Bearing Fe or A1 for Electronics Applications. 2013.
警告：這些引文格式不一定是100％准確.