Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2013
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| Subjects: | |
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| Physical Description: | xx, 179 leaves : illustrations ; 30 cm. |
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| Bibliography: | Bibliography: leaves 163-179. |