Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications /

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Bibliographic Details
Main Author: Shnawah, Dhafer Abdul-Ameer
Format: Thesis Book
Language:English
Published: 2013
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Description
Physical Description:xx, 179 leaves : illustrations ; 30 cm.
Bibliography:Bibliography: leaves 163-179.